Semiconductor Packaging — AuSn20 Eutectic
Anodes for Au-Sn Alloy Plating
Insoluble anodes for gold-tin eutectic plating (Au80/Sn20) —
the hermetic sealing standard for laser diodes, MEMS and RF devices.
Alloy Au80/Sn20 EutecticSoldering ~300 °C Flux-FreeAnode Pt / Ir-TaControl Thickness by Time
01 / Product Range
For Au-Sn Plating Baths
AU-SN BATH
Au-Sn Plating Anodes
Insoluble anodes stable in gold-tin plating chemistry, sized per rack or barrel line.
END USE
Laser Diode Submounts
Au-Sn eutectic layers enable flux-free hermetic bonding on optoelectronic submounts.
02 / Why Au-Sn Eutectic
The Packaging Engineer’s Choice
- Moderate brazing temperature — melts at ~300–310 °C, shortening the whole bonding cycle
- High strength — meets hermeticity requirements even at 250–260 °C service
- Flux-free bonding — 80% gold content means low oxidation; bonds in vacuum or forming gas without flux
- Excellent wetting & low erosion — minimal dissolution of thin gold layers, no silver migration
- Corrosion & creep resistant — with good thermal and electrical conductivity
Send Us Your Drawing or Working Conditions
Coating recommendation and quotation within 24 hours — samples in 7–10 days.