AU-SN SERIES

Au-Sn Eutectic Plating Anode

Anodes for AuSn20 eutectic plating — depositing Au80/Sn20 eutectic solder exactly where your package needs it.

Alloy Au80/Sn20Bonding ~300 °C Flux-FreeThickness Time-ControlledPhases AuSn δ + Au₅Sn ζ

01 / Key Features

Why This Anode

Moderate brazing temperature — melts ~300–310 °C, only 20–30 °C above eutectic point, shortening the bonding cycle
High strength — meets hermeticity requirements even at 250–260 °C service
Flux-free bonding — 80% gold content, low oxidation; bonds in vacuum or N₂/H₂ forming gas
Low viscosity in liquid state — fills larger gaps
Excellent wetting with minimal erosion of thin gold layers; no silver migration
Corrosion & creep resistant, with good thermal and electrical conductivity

02 / Specifications

Parameter	Specification
Alloy system	AuSn20 eutectic (Au 80% / Sn 20% by weight)
Phases	AuSn (δ) + Au₅Sn (ζ) low-temperature eutectic
Layer thickness	Controllable via deposition time
Bonding	Direct flux-free bonding to gold layers at ~300 °C
Anode supply	Insoluble Pt / Ir-Ta anodes for Au-Sn baths, sized per line